Semi-conductor device



Dec. 17, 1963 SABURO IWATA 3,114,866

SEMI-CONDUCTOR DEVI CE Filed Dec. 9. 1960 Znzzsnlcvr Saba r0 lwaia.

United States Patent Ofilice Patented 17, 1963 to Sony in, Tokyo, Japan, a coris a sectional view of the semiconductor in FEGURE 1 along the line Ill-41H.

o the driving, 1 represents a semiconductor e h for ex .rple as a tunnel diode. 2 denotes a wafer which constitutes one electrode of the semiconductor element, which wafer is, for exampile, a german water when the semiconductor is made of german n. 3 is a dot of an acceptor impurity which constitutes the other electrode, which dot is, for example, an indium dot when the other electrode is made of indium.

In accordance with this invention, two conductor plates and 5 are arranged oppositely and in parallel and apertures i are formed on the mid-part or" one conductor plate 5, while leaving a bridge portion 6 between the apertures 7. Another aperture 9 is formed on the midpart of the other conductor plate 4, leaving a tongue 8 which is proiected to the center of the aperture 9 from the inner ry thereof. The conductor plates 4 and 5 are ally insulated from each other by means of an in- St ator ring such for example a ceramic ring plate. The water 2 is soldered to the bridge portion 6 of the conductor plate 5 in the center space surrounded by the ins ator ring fill and the free end of the tongue 8 projecting from the other conductor plate 4 is turned towards the dot 3 and connected in ohmic contact therewith.

The conductor plates 4- and 5 may preferably be made of a metal such as nickel, nickel-iron alloy, cobalt or the like.

Preferably, the annular conductor plates 4 and 5 are provided with integral extension legs 11 and 12 for connecting the plates 4 and 5 to other circuits. In some cases, however, the legs 11 and 12 are dispensed with and the conductor plates 4 and 5 can be directly soldered to other circuits.

in the case where a ceramic plate is used as the insulator ring 10, it is difhcult to mount the ceramic plate directly to the conductor plates 4 and 5. To improve the bond between the two, I may provide metal layers it)" on both contact surfaces of the insulator ring by 2 .izing technique such as vacuum depoflame spraying, or the like thereafter the ate is soldered to the conductor plates iand 5' in the presence of the metal layers.

To this end, a porcelain plate, such as an aluminaforsterite plate, which is metalizable will preferably be Ioyed as the ceramic plate. On the free end of the no 8 will also be formed an indium-plated layer to h the dot 3 is welded. The semiconductor element thus assembled be sealed by an insulating resin 13, su a an epoxy resin, a melamine resin, or a phenolic desired.

The construction according to this invention has the ad vantage that an etchant vw'ch is used for electrolytic polishing, acid etching or the like will easily flow through apertures 7 9 in the process of making the semiconductor device, thereby facilitating the control of the etcr t T213 invention has also an additional advantage that mass production of such a semiconductor device can be attained by the simple assembly in which the dot 3 is connected to the conductor plate 4 by means of the ie 13 projected therefrom vv' out using any other lead vill be understood t many modifications and as may be effected out departing from the the novel concepts of this invention.

is claimed is:

1. A semiconductor device compris. g a semiconductor element having a semiconductor wafer and an impurity dot bonded thereon, a conductor plate having an aperture on the midpart thereof and a bridge portion through said aperture, said so iconductor wafer being secured to said bridge portion, a second conductor plate having an aperture on the midpart thereof and a tongue which projects to the center of said aperture from the periphery "*ereof, an insulator ring separating said conductor plates, the free end of said tongue being turned towards said dot and connected therewith, and a body of resin disposed about said semiconductor element and completely onclosing the end of said tongue.

2. A serr conductor device comprising a semiconductor element having a semiconductor wafer and an impurity dot dn .sed thereon, an annular conductor plate which is provided with an aperture on the midpart thereof and a bridge portion through said aperture, said semiconducer being soldered on bridge portion, another 'ctor plate which is provided with an aperture in a mid-part thereof and tongue which prolects to the center of said aperture from the periphery thereof, an insulator ring secured to said conductor plates and holding said plates in spaced parallel relationship, the free end of said tongue being turned towards said dot and connected therewith, legs integrally formed with said annular conductor plates, and a resin disposed about said semiconductor element and enclosing the end of said tongue for sealing said semiconductor element.

References Cited in the file of this patent UNITED STATES PATENTS 

1. A SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR ELEMENT HAVING A SEMICONDUCTOR WAFER AND AN IMPURITY DOT BONDED THEREON, A CONDUCTOR PLATE HAVING AN APERTURE ON THE MIDPART THEREOF AND A BRIDGE PORTION THROUGH SAID APERTURE, SAID SEMICONDUCTOR WAFER BEING SECURED TO SAID BRIDGE PORTION, A SECOND CONDUCTOR PLATE HAVING AN APERTURE ON THE MIDPART THEREOF AND A TONGUE WHICH PROJECTS TO THE CENTER OF SAID APERTURE FROM THE PERIPHERY THEREOF, AN INSULATOR RING SEPARATING SAID CONDUCTOR PLATES, THE FREE END OF SAID TONGUE BEING TURNED TOWARDS SAID DOT AND CONNECTED THEREWITH, AND A BODY OF RESIN DISPOSED ABOUT SAID SEMICONDUCTOR ELEMENT AND COMPLETELY ENCLOSING THE END OF SAID TONGUE. 